Summary
Traditional subtractive approaches are well established and therefore widely applied for high volume production of printed circuit boards and other high-performance electronic components. On the other hand, they require expensive specialised equipment, the subtractive nature of the processes results in high material waste, application of hazardous materials as well as complex and time-consuming procedures.
Rapid prototyping system for 3D printed electronics
The shortcomings mentioned above are becoming especially challenging, when rapid prototyping, small batches, customised designs or complex shape flexible and bendable devices are necessary to fabricate. These limitations are motivating the development and application of novel techniques for low cost electronic components fabrication, which would include fewer process steps, demonstrate better resource efficiency as well as enable avoiding the use of harmful materials. In addition, the demand for complex shape, flexible and bendable devices is growing rapidly and the market is expected to reach $73 billion in 2027, therefore it is very important to adapt to changing customer needs.
Additively manufactured printed electronics, which is a combination of electronics manufacturing and graphic fabrication can successfully complement traditional electronics fabrication methods, as it enables avoiding the need for expensive specialised equipment and complex manufacturing processes. In its simplest form, printed electronic components typically consist of base substrates and functional ink coatings, where ink is deposited over the substrate and subsequently post-process sintered, in order to remove the organic solvents, which are typically insulators, from the conductive ink. Such reduction in process steps is a huge advantage over multiple stage subtractive fabrication methods, particularly when rapid prototyping, fabrication of small batches of customised designs or complex shape, flexible devices are required.
Recent scientific achievements in the area of printed electronics allow the production of electronic devices with enhanced performances and versatility at a relatively low cost. The transfer from a single to multi-material applications, advances in the sequential deposition of insulators, conductors or semiconductors enable the progress from uncomplicated antennas and conductive interconnects towards fully printed complex, flexible electronic components, integrated within objects and smart devices at the same time offering high precision and less complex manufacturing in comparison to traditional fabrication methods. In contrast to conventional fabrication techniques, additive approaches allow avoiding expensive and time consuming mask fabrication, and the objects can be quickly fabricated according to a customised design, thus making the processes feasible when rapid prototyping or fabrication of customised components are necessary. These advantages are strong indicators that multi-material printed electronics could find its niche and complement traditional subtractive fabrication methods.
At SEAM we have the PJ15X machine from Neotech AMT. It is an economic rapid prototyping system for 3D printed electronics, which combines piezo-actuated printing technology with 5-axis motion control and is widely applicable in R&D, prototyping, and development of electronic components. The platform exploits Computer Numerical Control systems enabling high volume manufacturing, as well it supports a wide variety of functional inks including conductive nano-particles, adhesive dielectrics, and biological reagents that can be precisely deposited onto complex-shaped substrates.
Rokas holds a PhD degree in Mechanical Engineering from Kaunas University of Technology, Lithuania. His research work focused on a study of the influence of high-frequency excitation on the quality of microstructures replicated by thermal imprint technologies. Before joining SEAM Rokas was working as a postdoctoral researcher in microfabrication and micro assembly at Dublin City University. At SEAM Rokas is a member of additive manufacturing team and his research is focused on printed electronics, he is also working on I-Form project, where his role is embedding and integrating sensor in metal PBF components.
You can review some of Rokas work here .