ZEISS Xradia Context MicroCT

Available from July 2026

SEAM is expanding its advanced X-ray Computed Tomography (CT) capability with the addition of the ZEISS Xradia Context® MicroCT system, one of the most advanced microCT platforms available to industry and research.

The ZEISS Xradia Context MicroCT enhances the balance between image resolution, data quality, and practical applicability, enabling non-destructive, high-quality 3D imaging of complex samples. This system significantly enhances SEAM’s ability to support detailed materials analysis, failure investigation, and performance evaluation across a wide range of sectors.

How this enhances SEAM’s CT Scanning Capability

The addition of the ZEISS Xradia Context MicroCT strengthens SEAM’s CT offering in several key ways:

• High-quality imaging with enhanced detail
  A high-array detector enables the capture of fine internal details while maintaining a large field of view. This allows SEAM to image entire intact components rather than smaller sub-samples, improving representativeness and reducing preparation time.

• Advanced non-destructive testing (NDT)
  Clients can perform internal inspections and failure analysis without cutting or damaging parts, making it ideal for high-value components, electronic assemblies, additively manufactured parts, and sensitive materials.

• Comprehensive 3D and 4D analysis
  The system enables full 3D characterisation of internal structures and defects, as well as 4D evolutionary studies, where changes can be tracked over time through ex-situ treatment or in-situ sample manipulation.

• Improved workflow efficiency
  Rapid sample mounting and alignment, streamlined acquisition workflows, and fast data reconstruction significantly reduce turnaround times, allowing SEAM to support both R&D and industrial timelines more effectively.

• Deeper materials characterisation
  The system supports detailed quantification of performance-defining features such as porosity, cracks, inclusions, defects, and multi-phase structures—critical for materials development, quality assurance, and root-cause analysis.

• Correlative microscopy integration
  Integration with the ZEISS correlative microscopy environment allows non-destructive 3D CT data to be used to accurately identify regions of interest for subsequent high-resolution or destructive analysis, increasing insight while reducing unnecessary testing.

Applications

The ZEISS Xradia Context MicroCT will support applications including:

• Non-destructive failure analysis

• Inspection of electronic components and assemblies

• Analysis of complex geometries and engineered materials

• Geological and materials research (porosity, inclusions, fractures)

• Additive manufacturing validation

• Biological and multi-material specimen analysis